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    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    512-3M

    512-3M

    HEATSINK FOR PWR MOD/IGBT/RELAY

    Wakefield-Vette

    0
    RFQ
    512-3M

    Datasheet

    512 Bulk Active Top Mount Power Modules Adhesive Rectangular, Fins 3.000" (76.20mm) 7.200" (182.88mm) - 2.350" (59.69mm) - - 0.90°C/W Aluminum -
    342945-COPPER SKIVFIN

    342945-COPPER SKIVFIN

    342945,REV03(GP)

    Boyd Laconia, LLC

    0
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.551" (14.00mm) - - - Copper -
    342947-COPPER SKIVFIN

    342947-COPPER SKIVFIN

    342947,REV02(GP)

    Boyd Laconia, LLC

    0
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Rectangular, Fins 2.323" (59.00mm) 2.280" (57.91mm) - 0.433" (11.00mm) - - - Copper -
    125380

    125380

    5WX36" EXTRUSION 16414 XX7332

    Wakefield-Vette

    0
    RFQ
    125380

    Datasheet

    - Box Active Top Mount, Extrusion Power Modules Adhesive Rectangular, Fins 36.000" (914.40mm) 5.000" (127.00mm) - 1.500" (38.10mm) - - 0.63°C/W Aluminum -
    342943-COPPER SKIVFIN

    342943-COPPER SKIVFIN

    342943

    Boyd Laconia, LLC

    0
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 1.969" (50.00mm) 1.969" (50.00mm) - 0.551" (14.00mm) - - - Copper -
    HSF-48-19-Y-F

    HSF-48-19-Y-F

    FANSINK 5VDC 47.5X47.5X18.5MM

    Wakefield-Vette

    4
    RFQ
    HSF-48-19-Y-F

    Datasheet

    HSF Bulk Active Top Mount BGA Clip Square, Fins 1.870" (47.50mm) 1.870" (47.50mm) - 0.728" (18.50mm) - - 1.41°C/W Aluminum Alloy Black Anodized
    HSF-48-19-B-F

    HSF-48-19-B-F

    FANSINK 5VDC 47.5X47.5X18.5MM

    Wakefield-Vette

    2
    RFQ
    HSF-48-19-B-F

    Datasheet

    HSF Bulk Active Top Mount BGA Clip Square, Fins 1.870" (47.50mm) 1.870" (47.50mm) - 0.728" (18.50mm) - - 1.41°C/W Aluminum Alloy Black Anodized
    KK0729-02TE

    KK0729-02TE

    HEATSPREADER FOR TE0729-02

    Trenz Electronic GmbH

    1
    RFQ
    KK0729-02TE

    Datasheet

    TE0729 Bulk Obsolete Heat Spreader TE0729-02 Bolt On Rectangular 2.992" (76.00mm) 2.047" (52.00mm) - 0.354" (9.00mm) - - - - -
    125436

    125436

    8.35WX12" EXTRUSION 13668 XX4937

    Wakefield-Vette

    0
    RFQ
    125436

    Datasheet

    - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 12.000" (304.80mm) 8.350" (212.09mm) - 2.000" (50.80mm) - - 0.23°C/W Aluminum -
    125488

    125488

    4.75X36" EXTRUSION 4530 XX1024

    Wakefield-Vette

    1
    RFQ
    125488

    Datasheet

    - Box Active Board Level, Extrusion - Bolt On Rectangular, Fins 36.000" (914.40mm) 4.750" (120.65mm) - 1.245" (31.62mm) - - 0.50°C/W Aluminum -
    SF4P2U-F004-A01

    SF4P2U-F004-A01

    Intel Socket 2011 Series 145W 2U

    Cooltron Industrial Supply

    2
    RFQ
    SF4P2U-F004-A01

    Datasheet

    2011 Bulk Active Top Mount with Fan Intel LGA2011 2U Active CPU Cooler Push Pin Rectangular, Fins 3.524" (89.50mm) 3.524" (89.50mm) - 2.519" (64.00mm) 145.0W @ 25.1°C - 0.17°C/W Aluminum, Copper -
    KK0714-02

    KK0714-02

    HEATSPREADER FOR TE0714-02

    Trenz Electronic GmbH

    0
    RFQ

    -

    TE0714 Bulk Discontinued at Digi-Key Heat Spreader TE0714-02 Bolt On Rectangular 1.575" (40.00mm) 1.181" (30.00mm) - 0.236" (6.00mm) - - - - -
    1101A

    1101A

    THM,10761A REV --G

    Boyd Laconia, LLC

    0
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    SAR365ASX150MM

    SAR365ASX150MM

    EXTRUDED HEATSINK 216X150MM

    Sarnikon

    5
    RFQ
    SAR365ASX150MM

    Datasheet

    365AS Bulk Active Top Mount - Thermal Tape, Adhesive Rectangular, Fins 5.906" (150.00mm) 8.504" (216.00mm) - 3.268" (83.00mm) - - - Aluminum Natural Anodized
    HSF-55-35-B-F

    HSF-55-35-B-F

    FANSINK 12VDC 55X55X35.1MM

    Wakefield-Vette

    1
    RFQ
    HSF-55-35-B-F

    Datasheet

    HSF Bulk Active Top Mount BGA Clip Square, Fins 2.165" (55.00mm) 2.165" (55.00mm) - 1.303" (33.10mm) - - 0.59°C/W Aluminum Alloy Black Anodized
    476K

    476K

    HEATSINK MED HEXTYPE

    Wakefield-Vette

    0
    RFQ
    476K

    Datasheet

    476 Bulk Active Board Level Stud Mounted Diode Bolt On Rectangular, Fins 6.000" (152.40mm) 5.000" (127.00mm) - 5.000" (127.00mm) 50.0W @ 25°C 0.20°C/W @ 500 LFM 0.50°C/W Aluminum Black Anodized
    HSET875-X-B

    HSET875-X-B

    HEATSINK WITH FAN FOR ET875-X7/

    iBASE Technology

    1
    RFQ
    HSET875-X-B

    Datasheet

    - Box Active - - - - - - - - - - - - -
    V4511B

    V4511B

    PROFILE HEATSINK

    Assmann WSW Components

    0
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    HSIB903-BGA

    HSIB903-BGA

    AC, HEATSINK + FAN FOR IB903F/ I

    iBASE Technology

    1
    RFQ

    -

    - Box Active Top Mount IB903F - - - - - - - - - - -
    HSET875-1

    HSET875-1

    HEAT SPREADER FOR ET875-420/335

    iBASE Technology

    1
    RFQ
    HSET875-1

    Datasheet

    - Box Active - - - - - - - - - - - - -
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