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    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    507302B00000G

    507302B00000G

    HEATSINK TO-220 2.5W LOW PROFILE

    Boyd Laconia, LLC

    31,204
    RFQ
    507302B00000G

    Datasheet

    - Bulk Active Board Level TO-220 Bolt On Square, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.380" (9.65mm) 2.5W @ 60°C 10.00°C/W @ 200 LFM 24.00°C/W Aluminum Black Anodized
    574502B00000G

    574502B00000G

    HEATSINK TO-220 VERT MNT .75"

    Boyd Laconia, LLC

    39,642
    RFQ
    574502B00000G

    Datasheet

    - Bag Active Board Level TO-220 Clip Rectangular, Fins 0.750" (19.05mm) 0.860" (21.84mm) - 0.395" (10.03mm) 3.0W @ 60°C 8.00°C/W @ 400 LFM 21.20°C/W Aluminum Black Anodized
    290-1AB

    290-1AB

    HEATSINK TO-220 VERT/HORZ BLK

    Wakefield-Vette

    4,488
    RFQ
    290-1AB

    Datasheet

    290 Bulk Active Board Level TO-218, TO-202, TO-220 Bolt On Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 2.0W @ 44°C 7.00°C/W @ 400 LFM 22.00°C/W Aluminum Black Anodized
    V-1100-SMD/B-L

    V-1100-SMD/B-L

    HEAT SINK COPPER DPAK TO-252

    Assmann WSW Components

    6,405
    RFQ
    V-1100-SMD/B-L

    Datasheet

    - Bulk Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin
    V-1100-SMD/A-L

    V-1100-SMD/A-L

    HEATSINK TO-263 12.70X26.20MM

    Assmann WSW Components

    4,987
    RFQ
    V-1100-SMD/A-L

    Datasheet

    - Bulk Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.390" (9.91mm) - - 23.00°C/W Copper Tin
    577102B04000G

    577102B04000G

    HEATSINK TO-220 W/TAB .375"

    Boyd Laconia, LLC

    21,002
    RFQ
    577102B04000G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) 1.0W @ 30°C 8.00°C/W @ 400 LFM 25.90°C/W Aluminum Black Anodized
    V2017B

    V2017B

    HEATSINK ANOD ALUM CPU

    Assmann WSW Components

    3,057
    RFQ
    V2017B

    Datasheet

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) - Square, Pin Fins 0.394" (10.00mm) 0.394" (10.00mm) - 0.275" (7.00mm) - - 31.00°C/W Aluminum Black Anodized
    V6560W

    V6560W

    HEATSINK ALUM ANOD

    Assmann WSW Components

    4,885
    RFQ
    V6560W

    Datasheet

    - Tray Active Board Level TO-220 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) - - 10.00°C/W Aluminum Black Anodized
    V-1100-SMD/B

    V-1100-SMD/B

    HEAT SINK COPPER DPAK TO-252

    Assmann WSW Components

    14,896
    RFQ
    V-1100-SMD/B

    Datasheet

    - Tape & Reel (TR) Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin
    287-1ABE

    287-1ABE

    HEATSINK FOR TO220

    Wakefield-Vette

    3,947
    RFQ
    287-1ABE

    Datasheet

    287 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 4.0W @ 65°C 7.80°C/W @ 200 LFM 16.20°C/W Aluminum Black Anodized
    577202B00000G

    577202B00000G

    HEAT SINK TO-220 .500" COMPACT

    Boyd Laconia, LLC

    11,197
    RFQ
    577202B00000G

    Datasheet

    - Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.500" (12.70mm) 1.5W @ 40°C 10.00°C/W @ 200 LFM 24.40°C/W Aluminum Black Anodized
    576802B04000G

    576802B04000G

    HEAT SINK VERT PLUG-IN TO-220

    Boyd Laconia, LLC

    12,560
    RFQ
    576802B04000G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220, TO-262 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
    577102B00000G

    577102B00000G

    HEAT SINK TO-220 .375" COMPACT

    Boyd Laconia, LLC

    778
    RFQ
    577102B00000G

    Datasheet

    - Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) 3.0W @ 80°C 12.00°C/W @ 200 LFM 25.90°C/W Aluminum Black Anodized
    110991327

    110991327

    HEAT SINK KIT FOR RASPBERRY PI 4

    Seeed Technology Co., Ltd

    22,678
    RFQ
    110991327

    Datasheet

    - Bulk Active Top Mount Kit Raspberry Pi 4B Adhesive - - - - - - - - Aluminum -
    573300D00010G

    573300D00010G

    HEATSINK D2PAK .4" HIGH SMD

    Boyd Laconia, LLC

    21,954
    RFQ
    573300D00010G

    Datasheet

    - Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - 0.400" (10.16mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Aluminum Tin
    658-25AB

    658-25AB

    HEATSINK CPU 28MM SQ BLK

    Wakefield-Vette

    10,734
    RFQ
    658-25AB

    Datasheet

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
    HSB05-171711

    HSB05-171711

    HEAT SINK, BGA, 17 X 17 X 11.5 M

    Same Sky (Formerly CUI Devices)

    6,249
    RFQ
    HSB05-171711

    Datasheet

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.453" (11.50mm) 3.1W @ 75°C 8.40°C/W @ 200 LFM 23.91°C/W Aluminum Alloy Black Anodized
    574502B03300G

    574502B03300G

    HEATSINK TO-220 VERT MNT W/TAB

    Boyd Laconia, LLC

    8,221
    RFQ
    574502B03300G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.810" (20.57mm) - 0.390" (9.91mm) 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.20°C/W Aluminum Black Anodized
    658-60AB

    658-60AB

    HEATSINK CPU 28MM SQ BLK W/OTAPE

    Wakefield-Vette

    133
    RFQ
    658-60AB

    Datasheet

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.598" (15.20mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
    573100D00010G

    573100D00010G

    HEATSINK SMT D-PAK/TO-252 TIN

    Boyd Laconia, LLC

    11,190
    RFQ
    573100D00010G

    Datasheet

    5731 Tape & Reel (TR) Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - 0.400" (10.16mm) 0.8W @ 30°C 12.50°C/W @ 600 LFM 26.00°C/W Aluminum Tin
    Total 122183 Record«Prev1234...6110Next»
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