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    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    SC1148

    SC1148

    ACTIVE COOLER

    Raspberry Pi

    775
    RFQ

    -

    - Box Active - - - - - - - - - - - - -
    7109DG

    7109DG

    TOP MOUNT HEATSINK .45" D2PAK

    Boyd Laconia, LLC

    5,401
    RFQ
    7109DG

    Datasheet

    - Bag Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Copper Tin
    BDN18-3CB/A01

    BDN18-3CB/A01

    HEATSINK CPU W/ADHESIVE 1.81"SQ

    CTS Thermal Management Products

    354
    RFQ
    BDN18-3CB/A01

    Datasheet

    BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.355" (9.02mm) - 3.50°C/W @ 400 LFM 10.80°C/W Aluminum Black Anodized
    901-19-2-12-2-B-0

    901-19-2-12-2-B-0

    HEATSINK 19X19X12MM PIN

    Wakefield-Vette

    2,598
    RFQ
    901-19-2-12-2-B-0

    Datasheet

    901 Box Active Top Mount BGA Push Pin Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.457" (11.60mm) - 6.60°C/W @ 200 LFM 12.70°C/W Aluminum Black Anodized
    APF19-19-06CB/A01

    APF19-19-06CB/A01

    HEATSINK FORGED W/ADHESIVE TAPE

    CTS Thermal Management Products

    839
    RFQ
    APF19-19-06CB/A01

    Datasheet

    APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.250" (6.35mm) - 7.10°C/W @ 200 LFM - Aluminum Black Anodized
    531002B02500G

    531002B02500G

    HEATSINK TO-220 W/PINS 1" TALL

    Boyd Laconia, LLC

    584
    RFQ
    531002B02500G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
    APF19-19-10CB/A01

    APF19-19-10CB/A01

    HEATSINK FORGED W/ADHESIVE TAPE

    CTS Thermal Management Products

    3,434
    RFQ
    APF19-19-10CB/A01

    Datasheet

    APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.370" (9.40mm) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-54270D-C1-R0

    ATS-54270D-C1-R0

    HEAT SINK 27MM X 27MM X 9.5MM

    Advanced Thermal Solutions Inc.

    2,391
    RFQ
    ATS-54270D-C1-R0

    Datasheet

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.374" (9.50mm) - 14.10°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-CPX060060006-205-C2-R0

    ATS-CPX060060006-205-C2-R0

    HEATSINK 60X60X6MM XCUT CP

    Advanced Thermal Solutions Inc.

    213
    RFQ
    ATS-CPX060060006-205-C2-R0

    Datasheet

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.236" (6.00mm) - 13.00°C/W @ 100 LFM - Aluminum Blue Anodized
    C40-058-AE

    C40-058-AE

    HEATSINK FOR TO-247 TO-264

    Ohmite

    1,168
    RFQ
    C40-058-AE

    Datasheet

    C40 Box Active Board Level, Vertical TO-247, TO-264, SOT-227 Clip and Board Mounts Rectangular, Fins 2.283" (58.00mm) 1.724" (43.79mm) - 1.260" (32.00mm) - - - Aluminum Black Anodized
    ATS-P1-138-C2-R0

    ATS-P1-138-C2-R0

    HEATSINK 25X25X15MM L-TAB T766

    Advanced Thermal Solutions Inc.

    965
    RFQ
    ATS-P1-138-C2-R0

    Datasheet

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.590" (15.00mm) - 12.18°C/W @ 100 LFM - Aluminum Blue Anodized
    BDN18-6CB/A01

    BDN18-6CB/A01

    HEATSINK CPU W/ADHESIVE 1.81"SQ

    CTS Thermal Management Products

    349
    RFQ
    BDN18-6CB/A01

    Datasheet

    BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.605" (15.37mm) - 2.80°C/W @ 400 LFM 8.10°C/W Aluminum Black Anodized
    ATS-TI1OP-521-C1-R1

    ATS-TI1OP-521-C1-R1

    HEAT SINK FOR TI MOD #TPA3130D

    Advanced Thermal Solutions Inc.

    9,137
    RFQ
    ATS-TI1OP-521-C1-R1

    Datasheet

    - Bulk Active Top Mount - Bolt On Rectangular, Fins 1.969" (50.00mm) 0.547" (13.89mm) - 0.984" (25.00mm) - 8.50°C/W @ 200 LFM - Aluminum Black Anodized
    593002B03400G

    593002B03400G

    HEATSINK TWISTED FIN TO-220

    Boyd Laconia, LLC

    7,169
    RFQ
    593002B03400G

    Datasheet

    Channel 5900 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 0.942" (23.93mm) - 0.500" (12.70mm) 1.0W @ 20°C 4.00°C/W @ 600 LFM 13.40°C/W Aluminum Black Anodized
    532702B02500G

    532702B02500G

    HEATSINK TO-220 SOLDERPIN 50.8MM

    Boyd Laconia, LLC

    484
    RFQ
    532702B02500G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) 10.0W @ 50°C 2.00°C/W @ 300 LFM 4.80°C/W Aluminum Black Anodized
    ATS-56001-C1-R0

    ATS-56001-C1-R0

    HEAT SINK 19MM X 19MM X 9MM

    Advanced Thermal Solutions Inc.

    2,924
    RFQ
    ATS-56001-C1-R0

    Datasheet

    maxiFLOW Bulk Active Top Mount ASIC Thermal Tape, Adhesive (Included) Square, Angled Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.354" (9.00mm) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
    APF30-30-13CB/A01

    APF30-30-13CB/A01

    HEATSINK FORGED W/ADHESIVE TAPE

    CTS Thermal Management Products

    403
    RFQ
    APF30-30-13CB/A01

    Datasheet

    APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.500" (12.70mm) - 2.50°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-54150D-C1-R0

    ATS-54150D-C1-R0

    HEAT SINK 15MM X 15MM X 9.5MM

    Advanced Thermal Solutions Inc.

    1,564
    RFQ
    ATS-54150D-C1-R0

    Datasheet

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.374" (9.50mm) - 26.20°C/W @ 200 LFM - Aluminum Black Anodized
    APF40-40-06CB/A01

    APF40-40-06CB/A01

    HEATSINK FORGED W/ADHESIVE TAPE

    CTS Thermal Management Products

    608
    RFQ
    APF40-40-06CB/A01

    Datasheet

    APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.250" (6.35mm) - 3.30°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-55170D-C1-R0

    ATS-55170D-C1-R0

    HEAT SINK 17MM X 17MM X 9.5MM

    Advanced Thermal Solutions Inc.

    2,059
    RFQ
    ATS-55170D-C1-R0

    Datasheet

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.374" (9.50mm) - 28.00°C/W @ 200 LFM - Aluminum Black Anodized
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