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    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    M47059B011000G

    M47059B011000G

    MAX CLIP HEATSINK

    Boyd Laconia, LLC

    896
    RFQ
    M47059B011000G

    Datasheet

    Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Clip and PC Pin Rectangular, Angled Fins 0.591" (15.00mm) 0.764" (19.40mm) - 1.240" (31.50mm) - - - Aluminum Black Anodized
    V2030A

    V2030A

    HEATSINK CPU FORGED

    Assmann WSW Components

    1,715
    RFQ
    V2030A

    Datasheet

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.256" (6.50mm) - - 6.50°C/W Aluminum Alloy Clean Finished
    591202B00000G

    591202B00000G

    HEATSINK TO-220 VERT/HORZ MOUNT

    Boyd Laconia, LLC

    3,034
    RFQ
    591202B00000G

    Datasheet

    - Bag Active Board Level TO-220, TO-262 Clip Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 40°C 16.00°C/W @ 200 LFM 26.80°C/W Aluminum Black Anodized
    311505B00000G

    311505B00000G

    TO-5 PUSH-ON HEATSINK

    Boyd Laconia, LLC

    336
    RFQ
    311505B00000G

    Datasheet

    - Bulk Active Board Level TO-5 Press Fit Cylindrical - - 0.317" (8.05mm) ID, 0.375" (9.52mm) OD 0.400" (10.16mm) 1.0W @ 70°C 45.00°C/W @ 200 LFM 90.00°C/W Aluminum Black Anodized
    574902B00000G

    574902B00000G

    HEATSINK TO-220 CLIP-ON

    Boyd Laconia, LLC

    1,302
    RFQ
    574902B00000G

    Datasheet

    - Bulk Active Board Level TO-220 Clip Rectangular, Fins 1.375" (34.93mm) 0.860" (21.84mm) - 0.395" (10.03mm) 2.5W @ 40°C 6.00°C/W @ 400 LFM 16.00°C/W Aluminum Black Anodized
    658-25ABT1E

    658-25ABT1E

    HEATSINK CPU 28MM SQ BLK W/TAPE

    Wakefield-Vette

    2,111
    RFQ
    658-25ABT1E

    Datasheet

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
    M47079B011000G

    M47079B011000G

    MAX CLIP HEATSINK

    Boyd Laconia, LLC

    546
    RFQ
    M47079B011000G

    Datasheet

    Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Clip and PC Pin Rectangular, Angled Fins 0.790" (20.07mm) 0.764" (19.40mm) - 1.240" (31.50mm) - - - Aluminum Black Anodized
    7021B-MTG

    7021B-MTG

    HEATSINK TO-220 TAB FOLD 42.16MM

    Boyd Laconia, LLC

    6,795
    RFQ
    7021B-MTG

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) - 0.380" (9.65mm) 6.0W @ 50°C 4.00°C/W @ 300 LFM 6.80°C/W Aluminum Black Anodized
    7-339-3PP-BA

    7-339-3PP-BA

    HEATSINK PWR W/PINS BLACK TO-220

    CTS Thermal Management Products

    3,395
    RFQ
    7-339-3PP-BA

    Datasheet

    7 Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 40°C - 7.00°C/W Aluminum Black Anodized
    TGH-0250-01

    TGH-0250-01

    ALUMINIUM HEAT SINK 25X25MM

    t-Global Technology

    143
    RFQ
    TGH-0250-01

    Datasheet

    TGH Bulk Active Top Mount - - Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.354" (9.00mm) - - - Aluminum -
    TGH-0300-04

    TGH-0300-04

    ALUMINIUM HEAT SINK 30X30MM

    t-Global Technology

    105
    RFQ
    TGH-0300-04

    Datasheet

    TGH Bulk Active Top Mount - - Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.591" (15.01mm) - - - Aluminum -
    HSE08-505028

    HSE08-505028

    HEAT SINK, EXTRUSION, TO-218/TO-

    Same Sky (Formerly CUI Devices)

    699
    RFQ
    HSE08-505028

    Datasheet

    HSE Bag Active Board Level TO-218, TO-220 Clip Rectangular, Angled Fins 1.969" (50.00mm) 1.102" (28.00mm) - 1.969" (50.00mm) 10.53W @ 75°C 2.70°C/W @ 200 LFM 7.13°C/W Aluminum Alloy Black Anodized
    V2032N

    V2032N

    HEATSINK CPU FORGED

    Assmann WSW Components

    1,396
    RFQ
    V2032N

    Datasheet

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.728" (18.50mm) - - 5.00°C/W Aluminum Alloy Natural Anodized
    ATS-FPX054054013-17-C1-R0

    ATS-FPX054054013-17-C1-R0

    HEATSINK 54X54X12.7MM XCUT FP

    Advanced Thermal Solutions Inc.

    3,899
    RFQ
    ATS-FPX054054013-17-C1-R0

    Datasheet

    pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 2.126" (54.00mm) 2.126" (54.00mm) - 0.500" (12.70mm) - 15.42°C/W @ 100 LFM - Aluminum Blue Anodized
    658-35ABT3

    658-35ABT3

    HEATSINK CPU 28MM SQ BLK W/TAPE

    Wakefield-Vette

    1,023
    RFQ
    658-35ABT3

    Datasheet

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.350" (8.89mm) - 3.00°C/W @ 800 LFM - Aluminum Black Anodized
    V2276E1

    V2276E1

    CPU HEATSINK, CROSS CUT, AL6063,

    Assmann WSW Components

    345
    RFQ
    V2276E1

    Datasheet

    - Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.984" (25.00mm) - - 19.50°C/W Aluminum Alloy Black Anodized
    V4330F

    V4330F

    HEATSINK ALUM ANOD

    Assmann WSW Components

    236
    RFQ
    V4330F

    Datasheet

    - Bulk Active Board Level KLP Bolt On Rectangular, Fins 1.969" (50.00mm) 1.142" (29.00mm) - 0.453" (11.50mm) - - 10.00°C/W Aluminum Black Anodized
    577002B04000G

    577002B04000G

    HEATSINK TO-220 W/TAB .25

    Boyd Laconia, LLC

    1,060
    RFQ
    577002B04000G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.250" (6.35mm) 1.5W @ 50°C 16.00°C/W @ 200 LFM 32.00°C/W Aluminum Black Anodized
    HSE07-753045

    HSE07-753045

    HEAT SINK, EXTRUSION, TO-218/TO-

    Same Sky (Formerly CUI Devices)

    935
    RFQ
    HSE07-753045

    Datasheet

    HSE Bag Active Board Level TO-218, TO-220 Clip Rectangular, Fins 2.953" (75.00mm) 1.181" (30.00mm) - 1.772" (45.00mm) 15.46W @ 75°C 2.10°C/W @ 200 LFM 4.85°C/W Aluminum Alloy Black Anodized
    HSE09-755028

    HSE09-755028

    HEAT SINK, EXTRUSION, TO-218/TO-

    Same Sky (Formerly CUI Devices)

    965
    RFQ
    HSE09-755028

    Datasheet

    HSE Bag Active Board Level TO-218, TO-220 Clip Rectangular, Angled Fins 2.953" (75.00mm) 1.102" (28.00mm) - 1.969" (50.00mm) 13.26W @ 75°C 2.50°C/W @ 200 LFM 5.66°C/W Aluminum Alloy Black Anodized
    Total 122183 Record«Prev1... 3031323334353637...6110Next»
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