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    Heat Sinks

    制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    HSB25-282810

    HSB25-282810

    HEAT SINK, BGA, 28.5 X 28.5 X 10

    Same Sky (Formerly CUI Devices)

    1,544
    RFQ
    HSB25-282810

    Datasheet

    HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 1.122" (28.50mm) 1.122" (28.50mm) - 0.394" (10.00mm) 4.87W @ 75°C 5.10°C/W @ 200 LFM 15.41°C/W Aluminum Alloy Black Anodized
    7139DG

    7139DG

    HEATSINK TO-220 TIN CLIP-ON 13MM

    Boyd Laconia, LLC

    3,129
    RFQ
    7139DG

    Datasheet

    - Bulk Active Board Level TO-220 Clip and PC Pin Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) - 0.515" (13.08mm) 1.5W @ 50°C 8.00°C/W @ 500 LFM 28.30°C/W Copper Tin
    531002B00000G

    531002B00000G

    HEATSINK TO-220 BLACK 1"

    Boyd Laconia, LLC

    2,312
    RFQ
    531002B00000G

    Datasheet

    - Box Active Board Level, Vertical TO-220, TO-202 Bolt On Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 3.0W @ 40°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
    529802B00000G

    529802B00000G

    HEATSINK TO-220 10W H=1.5" BLK

    Boyd Laconia, LLC

    8,427
    RFQ
    529802B00000G

    Datasheet

    - Box Active Board Level, Vertical TO-220 Bolt On Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) 8.0W @ 40°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
    575703B00000G

    575703B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,133
    RFQ
    575703B00000G

    Datasheet

    - Bulk Active Board Level TO-3 Bolt On Rhombus 1.630" (41.40mm) 1.290" (32.77mm) - 0.750" (19.05mm) 2.0W @ 30°C 4.00°C/W @ 200 LFM 13.40°C/W Aluminum Black Anodized
    6030D(COPPER)G

    6030D(COPPER)G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    432
    RFQ
    6030D(COPPER)G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM 12.50°C/W Copper Tin
    V5220X

    V5220X

    HEATSINK ANOD ALUM W/PIN TO-220

    Assmann WSW Components

    606
    RFQ
    V5220X

    Datasheet

    - Tray Active Board Level, Vertical TO-220 Bolt On Rectangular, Fins 1.476" (37.50mm) 1.260" (32.00mm) - 0.787" (19.99mm) - - 8.00°C/W Aluminum Black Anodized
    TGH-0130-03

    TGH-0130-03

    ALUMINIUM HEAT SINK 35X13MM

    t-Global Technology

    297
    RFQ
    TGH-0130-03

    Datasheet

    TGH Bulk Active Top Mount - - Rectangular, Fins 1.378" (35.00mm) 0.512" (13.00mm) - 0.236" (6.00mm) - - - Aluminum Black Anodized
    ATS-PCB1074

    ATS-PCB1074

    HEATSINK TO-263 COPPER

    Advanced Thermal Solutions Inc.

    11,043
    RFQ
    ATS-PCB1074

    Datasheet

    - Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) - Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.401" (10.20mm) - 9.50°C/W @ 200 LFM 18.00°C/W Copper Tin
    V2277E1

    V2277E1

    CPU HEATSINK, CROSS CUT, AL6063,

    Assmann WSW Components

    292
    RFQ
    V2277E1

    Datasheet

    - Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.394" (10.00mm) - - 26.00°C/W Aluminum Alloy Black Anodized
    576802B03100G

    576802B03100G

    HEAT SINK HORIZ PLUG-IN TO-220

    Boyd Laconia, LLC

    13,633
    RFQ
    576802B03100G

    Datasheet

    - Bulk Active Board Level TO-220, TO-262 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
    625-45AB

    625-45AB

    HEATSINK CPU 25MM SQ H=.45" BLK

    Wakefield-Vette

    2,168
    RFQ
    625-45AB

    Datasheet

    625 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.450" (11.43mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
    529701B02500G

    529701B02500G

    HEATSINK TO-218 SOLDER PIN

    Boyd Laconia, LLC

    16,835
    RFQ
    529701B02500G

    Datasheet

    - Bulk Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.50°C/W Aluminum Black Anodized
    M47118B011000G

    M47118B011000G

    MAX CLIP HEATSINK

    Boyd Laconia, LLC

    607
    RFQ
    M47118B011000G

    Datasheet

    Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Clip and PC Pin Rectangular, Angled Fins 1.180" (29.97mm) 0.764" (19.40mm) - 1.240" (31.50mm) - - - Aluminum Black Anodized
    HSB15-404010

    HSB15-404010

    HEAT SINK, BGA, 40 X 40 X 10 MM

    Same Sky (Formerly CUI Devices)

    202
    RFQ
    HSB15-404010

    Datasheet

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.394" (10.00mm) 6.3W @ 75°C 3.90°C/W @ 200 LFM 11.84°C/W Aluminum Alloy Black Anodized
    579103B00000G

    579103B00000G

    HEATSINK TO-3 BLACK .87"

    Boyd Laconia, LLC

    1,075
    RFQ
    579103B00000G

    Datasheet

    - Bag Active Top Mount TO-3 Bolt On Rhombus 1.540" (39.12mm) - 1.125" (28.57mm) OD 0.870" (22.10mm) 2.5W @ 40°C 4.00°C/W @ 600 LFM 12.50°C/W Aluminum Black Anodized
    HSS01-B20-CP

    HSS01-B20-CP

    HEAT SINK, STAMPING, TO-220, 49.

    Same Sky (Formerly CUI Devices)

    975
    RFQ
    HSS01-B20-CP

    Datasheet

    HSS Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular 1.941" (49.31mm) 1.900" (48.26mm) - 0.950" (24.13mm) 9.9W @ 75°C 3.70°C/W @ 200 LFM 7.59°C/W Aluminum Alloy Black Anodized
    HSB14-353518

    HSB14-353518

    HEAT SINK, BGA, 35 X 35 X 18 MM

    Same Sky (Formerly CUI Devices)

    681
    RFQ
    HSB14-353518

    Datasheet

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.709" (18.00mm) 8.4W @ 75°C 3.60°C/W @ 200 LFM 8.97°C/W Aluminum Alloy Black Anodized
    TGH-0220-06

    TGH-0220-06

    ALUMINIUM HEAT SINK 27X22MM

    t-Global Technology

    229
    RFQ
    TGH-0220-06

    Datasheet

    TGH Bulk Active Top Mount - - Rectangular, Pin Fins 1.063" (27.00mm) 0.866" (22.00mm) - 0.354" (9.00mm) - - - Aluminum Black Anodized
    534202B02853G

    534202B02853G

    HEATSINK TO-220 W/SHURLOCK-CLIP

    Boyd Laconia, LLC

    19,247
    RFQ
    534202B02853G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Clip and Board Locks Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM 13.40°C/W Aluminum Black Anodized
    Total 122183 Record«Prev1... 1112131415161718...6110Next»
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