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    Solder

    制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





















































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
    TS391LT50

    TS391LT50

    THERMALLY STABLE SOLDER PASTE NO

    Chip Quik Inc.

    43
    RFQ
    TS391LT50

    Datasheet

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 1.76 oz (50g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
    SMDLTLFP10

    SMDLTLFP10

    SOLDER PASTE LOW TEMP 10CC W/TIP

    Chip Quik Inc.

    33
    RFQ
    SMDLTLFP10

    Datasheet

    - Dispenser Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 3 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMD291AXT5

    SMD291AXT5

    SOLDER PASTE NO CLEAN 63SN/37PB

    Chip Quik Inc.

    23
    RFQ
    SMD291AXT5

    Datasheet

    SMD2 Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 5 Leaded Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    EXB-SN63PB37

    EXB-SN63PB37

    SOLDER BAR SN63/PB37 1LB (454G)

    Chip Quik Inc.

    20
    RFQ
    EXB-SN63PB37

    Datasheet

    Super Low Dross™ Bulk Active Bar Solder Sn63Pb37 (63/37) - 361°F (183°C) - - - Leaded Bar, 1 lb (454g) - - -
    SMD291SNL10

    SMD291SNL10

    SOLDER PASTE NO-CLEAN 10CC SYR

    Chip Quik Inc.

    35
    RFQ
    SMD291SNL10

    Datasheet

    - Dispenser Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    TS391LT10

    TS391LT10

    THERMALLY STABLE SOLDER PASTE NO

    Chip Quik Inc.

    36
    RFQ
    TS391LT10

    Datasheet

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Syringe, 1.23 oz (35g), 10cc 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
    SMDIN66.3BI33.7

    SMDIN66.3BI33.7

    INDIUM/BISMUTH SOLDER WIRE (IN66

    Chip Quik Inc.

    36
    RFQ
    SMDIN66.3BI33.7

    Datasheet

    CHIPQUIK® Bulk Active Wire Solder In66.3Bi33.7 (66.3/33.7) 0.031" (0.79mm) 162°F (72°C) - - - Lead Free Spool 60 Months Date of Manufacture -
    SMDSWLF.031 4OZ

    SMDSWLF.031 4OZ

    SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.

    Chip Quik Inc.

    32
    RFQ
    SMDSWLF.031 4OZ

    Datasheet

    - Spool Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 20 AWG, 22 SWG - Lead Free Spool, 4 oz (113.40g) - - -
    SMDLTLFP10T5

    SMDLTLFP10T5

    SOLDER PASTE LOW TEMP LF T5 10CC

    Chip Quik Inc.

    40
    RFQ
    SMDLTLFP10T5

    Datasheet

    - Dispenser Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 5 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMDSWLTLFP32

    SMDSWLTLFP32

    SOLDER WIRE LOW TEMP 42/57/1 32'

    Chip Quik Inc.

    85
    RFQ
    SMDSWLTLFP32

    Datasheet

    - Bulk Active Wire Solder Bi57Sn42Ag1 (57/42/1) 0.030" (0.76mm) 280°F (138°C) - 21 AWG, 22 SWG - Lead Free - - - -
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