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    Solder

    制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





















































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
    SMD-SC-SAC405-0.031-1OZ

    SMD-SC-SAC405-0.031-1OZ

    SN95.5/AG4.0/CU0.5 .031" SOLDER

    Chip Quik Inc.

    41
    RFQ
    SMD-SC-SAC405-0.031-1OZ

    Datasheet

    SMD Bulk Active Wire Solder Sn95.5Ag4Cu0.5 (95.5/4/0.5) 0.031" (0.79mm) 423°F (217°C) - - - Lead Free Spool 60 Months - -
    EXLB-SN63PB37

    EXLB-SN63PB37

    SOLDER BAR SN63/PB37 1LB (454G)

    Chip Quik Inc.

    98
    RFQ
    EXLB-SN63PB37

    Datasheet

    Super Low Dross™ Bulk Active Bar Solder Sn63Pb37 (63/37) - 361°F (183°C) - - - Leaded Bar - Date of Manufacture -
    SMDSN90AU10-2FT

    SMDSN90AU10-2FT

    SOLDER WIRE (SN90/AU10) TIN/GOLD

    Chip Quik Inc.

    12
    RFQ
    SMDSN90AU10-2FT

    Datasheet

    CHIPQUIK® Bulk Active Wire Solder Sn90Au10 (90/10) 0.016" (0.40mm) 423°F (217°C) - - - Lead Free Spool 60 Months Date of Manufacture -
    CQ-SS-SAC405-0.30MM-25000

    CQ-SS-SAC405-0.30MM-25000

    SOLDER SPHERES SN95.5/AG4.0/CU0.

    Chip Quik Inc.

    19
    RFQ
    CQ-SS-SAC405-0.30MM-25000

    Datasheet

    CHIPQUIK® Bulk Active Solder Sphere Sn95.5Ag4Cu0.5 (95.5/4/0.5) 0.012" (0.31mm) 423°F (217°C) - - - Lead Free Jar 24 Months Date of Manufacture -
    CQ-SS-SAC405-0.60MM-25000

    CQ-SS-SAC405-0.60MM-25000

    SOLDER SPHERES SN95.5/AG4.0/CU0.

    Chip Quik Inc.

    19
    RFQ
    CQ-SS-SAC405-0.60MM-25000

    Datasheet

    CHIPQUIK® Bulk Active Solder Sphere Sn95.5Ag4Cu0.5 (95.5/4/0.5) 0.024" (0.61mm) 423°F (217°C) - - - Lead Free Jar 24 Months Date of Manufacture -
    WS991LT500T4C

    WS991LT500T4C

    THERMALLY STABLE SOLDER PASTE WS

    Chip Quik Inc.

    2
    RFQ
    WS991LT500T4C

    Datasheet

    CHIPQUIK® Bulk Active Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4) - 280°F (138°C) Water Soluble - - Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture 37°F ~ 77°F (3°C ~ 25°C)
    CQ-SS-SAC405-0.50MM-25000

    CQ-SS-SAC405-0.50MM-25000

    SOLDER SPHERES SN95.5/AG4.0/CU0.

    Chip Quik Inc.

    18
    RFQ
    CQ-SS-SAC405-0.50MM-25000

    Datasheet

    CHIPQUIK® Bulk Active Solder Sphere Sn95.5Ag4Cu0.5 (95.5/4/0.5) 0.020" (0.51mm) 423°F (217°C) - - - Lead Free Jar 24 Months Date of Manufacture -
    CQ-SS-6040-0.76MM

    CQ-SS-6040-0.76MM

    SOLDER SPHERES SN60/PB40 0.76MM

    Chip Quik Inc.

    4
    RFQ
    CQ-SS-6040-0.76MM

    Datasheet

    CHIPQUIK® Bulk Active Solder Sphere Sn60Pb40 (60/40) - 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture -
    EXLB-SN63PB37-20LB

    EXLB-SN63PB37-20LB

    SOLDER BAR SN63/PB37 20LBS (9.08

    Chip Quik Inc.

    2
    RFQ
    EXLB-SN63PB37-20LB

    Datasheet

    Super Low Dross™ Bulk Active Bar Solder Sn63Pb37 (63/37) - 361°F (183°C) - - - Leaded Bar - Date of Manufacture -
    SMD291AX50T3

    SMD291AX50T3

    SLDR PASTE NO-CLN SN63/PB37 50G

    Chip Quik Inc.

    0
    RFQ
    SMD291AX50T3

    Datasheet

    - Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 3 Leaded Jar, 1.76 oz (50g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
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