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    Socket Adapters

    制造商 Series Packaging Product Status Convert From (Adapter End) Convert To (Adapter End) Number of Pins Pitch - Mating Contact Finish - Mating Mounting Type Termination Pitch - Post Contact Finish - Post Housing Material Board Material













































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Convert From (Adapter End) Convert To (Adapter End) Number of Pins Pitch - Mating Contact Finish - Mating Mounting Type Termination Pitch - Post Contact Finish - Post Housing Material Board Material
    18-354000-10

    18-354000-10

    SOCKET ADAPTER DIP TO 18SOIC

    Aries Electronics

    0
    RFQ
    18-354000-10

    Datasheet

    Correct-A-Chip® 354000 Bulk Active DIP, 0.3" (7.62mm) Row Spacing SOIC 18 0.100" (2.54mm) Gold Surface Mount Solder 0.050" (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-354000-10

    32-354000-10

    SOCKET ADAPTER DIP TO 32SOIC

    Aries Electronics

    0
    RFQ
    32-354000-10

    Datasheet

    Correct-A-Chip® 354000 Bulk Active DIP, 0.3" (7.62mm) Row Spacing SOIC 32 - Gold Surface Mount Solder 0.100" (2.54mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-352000-10

    20-352000-10

    SOCKET ADAPTER PLCC TO 20DIP 0.3

    Aries Electronics

    0
    RFQ
    20-352000-10

    Datasheet

    Correct-A-Chip® 352000 Bulk Active PLCC DIP, 0.3" (7.62mm) Row Spacing 20 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
    20-353000-10

    20-353000-10

    SOCKET ADAPTER PLCC TO 20DIP 0.3

    Aries Electronics

    0
    RFQ
    20-353000-10

    Datasheet

    Correct-A-Chip® 353000 Bulk Active PLCC DIP, 0.3" (7.62mm) Row Spacing 20 0.050" (1.27mm) Tin-Lead Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
    28-352000-10

    28-352000-10

    SOCKET ADAPTER PLCC TO 28DIP 0.3

    Aries Electronics

    0
    RFQ
    28-352000-10

    Datasheet

    Correct-A-Chip® 352000 Bulk Active PLCC DIP, 0.3" (7.62mm) Row Spacing 28 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
    28-353000-10

    28-353000-10

    SOCKET ADAPTER PLCC TO 28DIP 0.3

    Aries Electronics

    0
    RFQ
    28-353000-10

    Datasheet

    Correct-A-Chip® 353000 Bulk Active PLCC DIP, 0.3" (7.62mm) Row Spacing 28 0.050" (1.27mm) Tin-Lead Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
    1111163

    1111163

    SOCKET ADAPTER SOCKET TO 40PLCC

    Aries Electronics

    0
    RFQ
    1111163

    Datasheet

    Correct-A-Chip® 1111163 Bulk Active Socket, 0.6" (15.24mm) Row Spacing PLCC 40 - Gold - - - - Polyamide (PA46), Nylon 4/6, Glass Filled FR4 Epoxy Glass
    10-665000-00

    10-665000-00

    SCK ADAPT 10P SOIC-W TO SOIC 0.6

    Aries Electronics

    0
    RFQ
    10-665000-00

    Datasheet

    Correct-A-Chip® 665000 Bulk Active SOIC-W SOIC 10 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
    12-665000-00

    12-665000-00

    SCK ADAPT 12P SOIC-W TO SOIC 0.6

    Aries Electronics

    0
    RFQ
    12-665000-00

    Datasheet

    Correct-A-Chip® 665000 Bulk Active SOIC-W SOIC 12 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
    1111903

    1111903

    SOCKET ADAPT SOWIC TO 24DIP 0.4

    Aries Electronics

    0
    RFQ
    1111903

    Datasheet

    Correct-A-Chip® 1111903 Bulk Active SOWIC DIP, 0.4" (10.16mm) Row Spacing 24 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
    24-354W00-20

    24-354W00-20

    DIP-TO-SOWIC ADAPTER

    Aries Electronics

    0
    RFQ
    24-354W00-20

    Datasheet

    Correct-A-Chip® 354W00 Bulk Active DIP, 0.3" (7.62mm) Row Spacing SOWIC 24 0.100" (2.54mm) Gold Through Hole Solder 0.050" (1.27mm) Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-304504-18

    22-304504-18

    SOCKET ADAPTER SOIC TO 22DIP 0.4

    Aries Electronics

    0
    RFQ
    22-304504-18

    Datasheet

    Correct-A-Chip® 304504 Bulk Active SOIC DIP, 0.4" (10.16mm) Row Spacing 22 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
    7131-108-18

    7131-108-18

    SOCKET ADAPT HB2E RELAY TO 8DIP

    Aries Electronics

    0
    RFQ
    7131-108-18

    Datasheet

    - Bulk Active HB2E Relay DIP, 0.3" (7.62mm) Row Spacing 8 - - Through Hole Solder - Tin-Lead - FR4 Epoxy Glass
    18-354000-11-RC

    18-354000-11-RC

    SOCKET ADAPTER DIP TO 18SOIC

    Aries Electronics

    0
    RFQ
    18-354000-11-RC

    Datasheet

    Correct-A-Chip® 354000 Bulk Active DIP, 0.3" (7.62mm) Row Spacing SOIC 18 0.100" (2.54mm) Gold Surface Mount Solder 0.050" (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-354000-21-RC

    18-354000-21-RC

    SOCKET ADAPTER DIP TO 18SOIC

    Aries Electronics

    0
    RFQ
    18-354000-21-RC

    Datasheet

    Correct-A-Chip® 354000 Bulk Active DIP, 0.3" (7.62mm) Row Spacing SOIC 18 0.100" (2.54mm) Gold Surface Mount Solder 0.050" (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-307349-11-RC

    16-307349-11-RC

    SOCKET ADAPTER PLCC TO 16DIP 0.3

    Aries Electronics

    0
    RFQ
    16-307349-11-RC

    Datasheet

    Correct-A-Chip® 307349 Bulk Active PLCC DIP, 0.3" (7.62mm) Row Spacing 16 0.050" (1.27mm) Gold Through Hole Solder 0.100" (2.54mm) Gold - FR4 Epoxy Glass
    MIKROE-231

    MIKROE-231

    SOCKET ADAPTER AT90PWM2 TO 40DIP

    MikroElektronika

    0
    RFQ

    -

    - Bulk Obsolete AT90PWM2 DIP 40 - - - - - - - -
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